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Influence of Substrate Temperature on Structural Properties and Deposition Rate of AlN Thin Film Deposited by Reactive Magnetron Sputtering
Journal article   Peer reviewed

Influence of Substrate Temperature on Structural Properties and Deposition Rate of AlN Thin Film Deposited by Reactive Magnetron Sputtering

Hao Jin, Bin Feng, Shurong Dong, Changjian Zhou, Jian Zhou, Yi Yang, Tianling Ren, Jikui Luo and Demiao Wang
Journal of electronic materials, Vol.41(7), pp.1948-1954
01/07/2012

Abstract

Engineering Engineering, Electrical & Electronic Materials Science Materials Science, Multidisciplinary Physical Sciences Physics Physics, Applied Science & Technology Technology
Aluminum nitride (AlN) thin films with c-axis preferred orientation have been prepared by reactive direct-current (DC) magnetron sputtering. The degree of preferred crystal orientation, the cross-sectional structure, and the surface morphology of AlN thin films grown on Si (100) substrates at various substrate temperatures from 60A degrees C to 520A degrees C have been investigated by x-ray diffraction, scanning electron microscopy, and atomic force microscopy. Results show that the substrate temperature has a significant effect on the structural properties, such as the degree of c-axis preferred orientation, the full-width at half-maximum (FWHM) of the rocking curve, the surface morphology, and the cross-sectional structure as well as the deposition rate of the AlN thin films. The optimal substrate temperature is 430A degrees C, with corresponding root-mean-square surface roughness (R (rms)) of 1.97 nm, FWHM of AlN (002) diffraction of 2.259A degrees, and deposition rate of 20.86 nm/min. The mechanisms behind these phenomena are discussed. Finally, film bulk acoustic resonators based on AlN films were fabricated; the corresponding typical electromechanical coupling coefficient (k (t) (2) ) is 5.1% with series and parallel frequencies of 2.37 GHz and 2.42 GHz, respectively.

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